Influence of crystallographic texture on the strength and electrical conductivity of ultrafine-grained copper

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The paper covers the study of the influence of equal-channel angular pressing (ECAP) on the structure, crystallographic texture, mechanical properties and electrical conductivity of Cu-ETP copper (Russian analogue – M1), as well as the dependence of these characteristics on the orientation of the measurement direction relative to the cross-section (from −45 to 90°). The specific electrical conductivity and strength characteristics of the material in the as-delivered condition (hot-rolled) and the effect of annealing at a temperature of 450 °C of the original sample are investigated. Mechanical tests for uniaxial tension, a study of microhardness using the Vickers method and a study of specific electrical conductivity based on measuring the parameters of the vortex field excited in the surface layers of the body are carried out. It is found that ECAP processing leads to a significant increase in the ultimate tensile strength to 425 MPa compared to the initial state of 300 MPa. The maximum tensile strength of 425 MPa is achieved at orientation angles relative to the ECAP cross-section of −45°. A significant increase in microhardness to 1364–1405 MPa, tensile strength to 350–425 MPa and electrical conductivity to 101.4–102.4 % IACS is a consequence of the selected directions of cutting the samples relative to the ECAP axis. This indicates the dependence of both mechanical and electrical properties of ultrafine-grained samples on the crystallographic texture orientation. A Cu-ETP copper sample subjected to ECAP with a cutting angle deviating from the ECAP cross-section of the sample by 7.5° has the most optimal crystallographic orientation. In this case, the values of microhardness and electrical conductivity reached 1405 MPa and 102.4 % IACS, respectively.

About the authors

Danila V. Tarov

Ufa University of Science and Technology

Author for correspondence.
Email: tarovdv@gmail.com

student of Chair of Materials Science and Physics of Metals

Россия, 450076, Russia, Ufa, Zaki Validi Street, 32

Konstantin M. Nesterov

Ufa University of Science and Technology

Email: kmnesterov@mail.ru

PhD (Physics and Mathematics), assistant professor of Chair of Materials Science and Physics of Metals

Россия, 450076, Russia, Ufa, Zaki Validi Street, 32

Rinat K. Islamgaliev

Ufa University of Science and Technology

Email: rinatis@mail.ru

Doctor of Sciences (Physics and Mathematics), professor of Chair of Materials Science and Physics of Metals

Россия, 450076, Russia, Ufa, Zaki Validi Street, 32

Elena A. Korznikova

Ufa University of Science and Technology

Email: elena.a.korznikova@gmail.com
ORCID iD: 0000-0002-5975-4849

Doctor of Sciences (Physics and Mathematics), professor of Chair of Materials Science and Physics of Metals

Россия, 450076, Russia, Ufa, Zaki Validi Street, 32

References

  1. Murashkin M.Y., Sabirov I., Sauvage X., Valiev R.Z. Nanostructured Al and Cu alloys with superior strength and electrical conductivity. Journal of Materials Science, 2016, vol. 51, pp. 33–49. doi: 10.1007/s10853-015-9354-9.
  2. Fu Qianqian, Li Bing, Gao Minqiang, Fu Ying, Yu Rongzhou, Wang Changfeng, Guan Renguo. Quantitative mechanisms behind the high strength and electrical conductivity of Cu-Te alloy manufactured by continuous extrusion. Journal of Materials Science & Technology, 2022, vol. 121, pp. 9–18. doi: 10.1016/j.jmst.2021.12.046.
  3. Fan G.J., Choo H., Liaw P.K., Lavernia E.J. Plastic deformation and fracture of ultrafine-grained Al–Mg alloys with a bimodal grain size distribution. Acta Materialia, 2006, vol. 54, no. 7, pp. 1759–1766. doi: 10.1016/j.actamat.2005.11.044.
  4. Cui Lang, Shao Shengmin, Wang Haitao, Zhang Guoqing, Zhao Zejia, Zhao Chunyang. Recent Advances in the Equal Channel Angular Pressing of Metallic Materials. Processes, 2022, vol. 10, no. 11, article number 2181. doi: 10.3390/pr10112181.
  5. Mao Qingzhong, Zhang Yusheng, Guo Yazhou, Zhao Yonghao. Enhanced electrical conductivity and mechanical properties in thermally stable fine-grained copper wire. Communications Materials, 2021, no. 2, article number 46. doi: 10.1038/s43246-021-00150-1.
  6. Damavandi E., Nourouzi S., Rabiee S.M., Jamaati R., Szpunar J.A. Effect of route BC-ECAP on microstructural evolution and mechanical properties of Al–Si–Cu alloy. Journal of Materials Science, 2021, vol. 56, pp. 3535–3550. doi: 10.1007/s10853-020-05479-5.
  7. Beyerlein I.J., Toth L.S. Texture evolution in equal-channel angular extrusion. Progress in Materials Science, 2009, vol. 54, no. 4, pp. 427–510. doi: 10.1016/j.pmatsci.2009.01.001.
  8. Alateyah A.I., Ahmed M.M.Z., Zedan Y., El-Hafez H.A., Alawad M.O., El-Garaihy W.H. Experimental and Numerical Investigation of the ECAP Processed Copper: Microstructural Evolution, Crystallographic Texture and Hardness Homogeneity. Metals, 2021, vol. 11, no. 4, article number 607. doi: 10.3390/met11040607.
  9. Chen Jianqing, Su Yehan, Zhang Qiyu, Sun Jiapeng, Yang Donghui, Jiang Jinghua, Song Dan, Ma Aibin. Enhancement of strength-ductility synergy in ultrafine-grained Cu-Zn alloy prepared by ECAP and subsequent annealing. Journal of Materials Research and Technology, 2022, vol. 17, no. 2, pp. 433–440. doi: 10.1016/j.jmrt.2022.01.026.
  10. Wang Y.M., Ma E. Three strategies to achieve uniform tensile deformation in a nanostructured metal. Acta Materialia, 2004, vol. 52, no. 6, pp. 1699–1709. doi: 10.1016/j.actamat.2003.12.022.
  11. Zhao Yong-Hao, Bingert J.F., Liao Xiao-Zhou et al. Simultaneously increasing the ductility and strength of ultrafine-grained pure copper. Advanced Materials, 2006, vol. 18, no. 22, pp. 2949–2953. doi: 10.1002/adma.200601472.
  12. Sanders P.G., Eastman J.A., Weertman J.R. Elastic and tensile behavior of nanocrystalline copper and palladium. Acta Materialia, 1997, vol. 45, no. 10, pp. 4019–4025. doi: 10.1016/S1359-6454(97)00092-X.
  13. Fu H.H., Benson D.J., Meyers M.A. Analytical and computational description of effect of grain size on yield stress of metals. Acta Materialia, 2001, vol. 49, no. 13, pp. 2567–2582. doi: 10.1016/S1359-6454(01)00062-3.
  14. Lu Lei, Shen Yongfeng, Chen Xianhua, Qian Lihua, Lu K. Ultrahigh strength and high electrical conductivity in copper. Science, 2004, vol. 304, no. 5669, pp. 422–426. doi: 10.1126/science.1092905.
  15. Islamgaliev R.K., Nesterov K.M., Bourgon J., Champion Y., Valiev R.Z. Nanostructured Cu-Cr alloy with high strength and electrical conductivity. Journal of Applied Physics, 2014, vol. 115, no. 19, article number 194301. doi: 10.1063/1.4874655.
  16. Dalla Torre F., Lapovok R., Sandlin J., Thomson P.F., Davies C.H.J., Pereloma E.V. Microstructures and properties of copper processed by equal channel extrusion for 1-16 passes. Acta Materialia, 2004, vol. 52, no. 16, pp. 4819–4832. doi: 10.1016/j.actamat.2004.06.040.
  17. Sarada B.V., Pavithra Ch.L.P., Ramakrishna M., Rao T.N., Sundararajan G. Highly (111) textured copper foils with high hardness and high electrical conductivity by pulse reverse electrodeposition. Electrochemical and Solid-State Letters, 2010, vol. 13, no. 6, pp. D40–D42. doi: 10.1149/1.3358145.
  18. Takata N., Lee Seong-Hee, Tsuji N. Ultrafine grained copper alloy sheets having both high strength and high electric conductivity. Materials Letters, 2009, vol. 63, no. 21, pp. 1757–1760. doi: 10.1016/j.matlet.2009.05.021.
  19. Hanazaki K., Shigeiri N., Tsuji N. Change in microstructures and mechanical properties during deep wire drawing of copper. Materials Science and Engineering: A, 2010, vol. 527, no. 21-22, pp. 5699–5707. doi: 10.1016/j.msea.2010.05.057.
  20. Skrotzki W., Tränkner C., Chulist R., Beausir B., Suwas S., Tóth L.S. Texture heterogeneity in ECAP deformed copper. Solid State Phenomena, 2010, vol. 160, pp. 47–54. doi: 10.4028/ href='www.scientific.net/SSP.160.47' target='_blank'>www.scientific.net/SSP.160.47.
  21. Guo Tingbiao, Wei Shiru, Wang Chen, Li Qi, Jia Zhi. Texture evolution and strengthening mechanism of single crystal copper during ECAP. Materials Science and Engineering: A, 2019, vol. 759, pp. 97–104. doi: 10.1016/j.msea.2019.05.042.

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Copyright (c) 2025 Tarov D.V., Nesterov K.M., Islamgaliev R.K., Korznikova E.A.

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