The influence of deformation at cryogenic or room temperature followed by annealing on the structure and properties of copper and its Cu–3Pd and Cu–3Pd–3Ag (at. %) alloys

Cover Page

Cite item

Full Text

Abstract

Due to low electrical resistivity, the Cu–Pd and Cu–Pd–Ag system alloys can be used as corrosion-resistant conductors of weak electrical signals. The paper deals with a comparison of the structure and physical-mechanical properties of Cu, Cu–3Pd and Cu–3Pd–3Ag (at. %) alloys after deformation at room or cryogenic temperature followed by annealing. The authors studied specimens in different initial states: quenched, deformed at room and cryogenic temperatures. To study the processes of structure rearrangement and the evolution of properties, annealing was carried out in the temperature range from 100 to 450 °C, followed by cooling in water. The duration of heat treatments was 1 h. The dependences of the yield strength and elongation to failure on the annealing temperature showed that cryodeformation significantly increases the thermal stability of the structure of both pure copper and the Cu–3Pd–3Ag ternary alloy. According to the temperature dependence of specific electrical resistivity of the deformed Cu–3Pd–3Ag alloy during heating at a rate of 120 deg./h, it was found that the decrease in electrical resistance caused by recrystallization begins at above 300 °C. The dependences of specific electrical resistivity on true strain showed that the structure rearrangement mechanisms during deformation are different for pure copper and the Cu–3Pd–3Ag alloy. The results of mathematical processing of the peaks in the diffraction patterns established that two phases appear in the Cu–3Pd–3Ag alloy after cryodeformation and annealing, one of which is silver-enriched, and the other is depleted. The study showed that during annealing of the deformed (especially after cryodeformation) Cu–3Pd–3Ag alloy, an anomalous increase in strength properties is observed. It was identified that alloying copper with palladium and silver leads to an increase in the recrystallization temperature. Thus, copper alloys with small palladium and silver additives are obviously attractive for practical applications, since they have improved strength properties, satisfactory electrical conductivity, and a higher recrystallization temperature compared to pure copper.

About the authors

Oksana S. Novikova

M.N. Mikheev Institute of Metal Physics of Ural Branch of RAS, Yekaterinburg

Author for correspondence.
Email: novikova@imp.uran.ru
ORCID iD: 0000-0003-0474-8991

PhD (Physics and Mathematics), senior researcher of the Strength Laboratory

Russian Federation

Alina E. Kostina

M.N. Mikheev Institute of Metal Physics of Ural Branch of RAS, Yekaterinburg

Email: kostina_a@imp.uran.ru

postgraduate student, junior researcher of the Strength Laboratory

Russian Federation

Yury A. Salamatov

M.N. Mikheev Institute of Metal Physics of Ural Branch of RAS, Yekaterinburg

Email: salamatov@imp.uran.ru
ORCID iD: 0000-0002-3857-2392

PhD (Physics and Mathematics), senior researcher of the Laboratory for Neutron-Synchrotron Research of Nanostructures

Russian Federation

Dmitry A. Zgibnev

M.N. Mikheev Institute of Metal Physics of Ural Branch of RAS, Yekaterinburg;
Ural Federal University named after the first President of Russia B.N. Yeltsin, Yekaterinburg

Email: ske4study@gmail.com

student, laboratory assistant of the Strength Laboratory

Russian Federation

Aleksey Yu. Volkov

M.N. Mikheev Institute of Metal Physics of Ural Branch of RAS, Yekaterinburg

Email: volkov@imp.uran.ru
ORCID iD: 0000-0002-0636-6623

Doctor of Sciences (Engineering), Head of the Strength Laboratory

Russian Federation

References

  1. Deryagina I.L., Popova E.N., Valova-Zaharevskaya E.G., Patrakov E.I. Structure and thermal stability of high-strength cu–18nb composite depending on the degree of deformation. The Physics of Metals and Metallography, 2018, vol. 119, no. 1, pp. 92–102. doi: 10.1134/S0031918X18010088.
  2. Chzhigan Ch., Tszyunvey L., Shitsyan L., Yanni S., Yuan M. Mechanisms of high-temperature deformation of the Cu-Be alloy in the high-elastic annealed state. Fizika metallov i metallovedenie, 2018, vol. 119, no. 1, pp. 73–80. doi: 10.7868/S0015323018010096.
  3. Valiev R.Z., Straumal B., Langdon T.G. Using severe plastic deformation to produce nanostructured materials with superior properties. Annual Review of Materials Research, 2022, vol. 52, pp. 357–382. doi: 10.1146/annurev-matsci-081720-123248.
  4. Zhang Zh., Ru Ya., Zuo T.T., Xue J., Wu Y., Gao Z., Liu Y., Xiao L. Achieving High Strength and High Conductivity of Cu-6 wt%Ag Sheets by Controlling the Aging Cooling Rate. Materials, 2023, vol. 16, no. 10, article number 3632. doi: 10.3390/ma16103632.
  5. Gubicza J., Hegedus Z., Labar J.L., Kauffmann A., Freudenberger J., Subramanya Sarma V. Solute redistribution during annealing of a cold rolled Cu–Ag alloy. Journal of Alloys and Compounds, 2015, vol. 623, pp. 96–103. doi: 10.1016/j.jallcom.2014.10.093.
  6. Bonvalet M., Sauvage X., Blavette D. Intragranular nucleation of tetrahedral precipitates and discontinuous precipitation in Cu-5wt%Ag. Acta Materialia, 2019, vol. 164, pp. 454–463. doi: 10.1016/j.actamat.2018.10.055.
  7. Sitarama Raju K., Subramanya Sarma V., Kauffmann A., Hegedus Z., Gubicza J., Peterlechner M., Freudenberger J., Wilde G. High strength and ductile ultrafine grained Cu–Ag alloy through bimodal grain size, dislocation density and solute distribution. Acta Materialia, 2013, vol. 61, no. 1, pp. 228–238. doi: 10.1016/j.actamat.2012.09.053.
  8. Konkova T.N., Mironov S.Y., Danilenko V.N., Korznikov A.V. Effect of low-temperature rolling on the structure of copper. The Physics of Metals and Metallography, 2010, vol. 110, no. 4, pp. 318–330.
  9. Guo S., Liu S., Liu J., Gao Z., Liu Z. Investigation on Strength, Ductility and Electrical Conductivity of Cu-4Ag Alloy Prepared by Cryorolling and Subsequent Annealing Process. Journal of Materials Engineering and Performance, 2019, vol. 28, pp. 6809–6815. doi: 10.1007/s11665-019-04448-7.
  10. Wu X., Wang R., Peng C., Zeng J. Ultrafine grained Cu–3Ag-xZr (x = 0.5, 1.0 wt%) alloys with high strength and good ductility fabricated through rapid solidification and cryorolling. Materials Science and Engineering: A, 2020, vol. 778, article number 139095. doi: 10.1016/j.msea.2020.139095.
  11. Wang W., Chen Z.-N., Guo E.-Y., Kang H.-J., Liu Y., Zou C.-L., Li R.-G., Yin G.-M., Wang T.-W. Influence of Cryorolling on the Precipitation of Cu-Ni-Si Alloys: An In Situ X-ray Diffraction Study. Acta Metallurgica Sinica (English Letters), 2018, vol. 31, pp. 1089–1097. doi: 10.1007/s40195-018-0781-x.
  12. Kauffmann A., Geissler D., Freudenberger J. Thermal stability of electrical and mechanical properties of cryo-drawn Cu and CuZr wires. Materials Science and Engineering: A, 2016, vol. 651, pp. 567–573. doi: 10.1016/j.msea.2015.10.119.
  13. Strzepek P., Mamala A., Zasadzinska M., Franczak K., Jurkiewicz B. Research on the drawing process of Cu and CuZn wires obtained in the cryogenic conditions. Cryogenics, 2019, vol. 100, pp. 11–17. doi: 10.1016/j.cryogenics.2019.03.007.
  14. Xu H., Qin I., Clauberg H., Chylak B., Acoff V.L. Behavior of palladium and its impact on intermetallic growth in palladium-coated Cu wire bonding. Acta Materialia, 2013, vol. 61, no. 1, pp. 79–88. doi: 10.1016/j.actamat.2012.09.030.
  15. Volkov A.Y., Novikova O.S., Kostina A.E., Antonov B.D. Effect of alloying with palladium on the electrical and mechanical properties of copper. The Physics of Metals and Metallography, 2016, vol. 117, no. 9, pp. 945–954. doi: 10.1134/S0031918X16070176.
  16. An B., Niu R., Xin Y., Starch W.L., Xiang Z., Su Y., Goddard R.E., Lu J., Siegrist T.M., Wang E., Han K. Suppression of discontinuous precipitation and strength improvement by Sc doping in Cu-6 wt%Ag alloys. Journal of Materials Science and Technology, 2022, vol. 135, pp. 80–96. doi: 10.1016/j.jmst.2022.06.043.
  17. Iwamoto C., Adachi N., Watanabe F., Koitabash R. Microstructure Evolution in Cu-Pd-Ag Alloy Wires During Heat Treatment. Metallurgical and Materials Transactions A, 2018, vol. 49, pp. 4947–4955. doi: 10.1007/s11661-018-4800-3.
  18. Novikova O.S., Volkova E.G., Glukhov A.V., Antonova O.V., Kostina A.E., Antonov B.D., Volkov A.Yu. Evolution of the microstructure, electrical resistivity and microhardness during atomic ordering of cryogenically deformed Cu-47at.%Pd alloy. Journal of Alloys and Compounds, 2020, vol. 838, article number 155591. doi: 10.1016/j.jallcom.2020.155591.
  19. Williamson G.K., Hall W.H. X-ray line broadening from filed aluminum and wolfram. Acta Metallurgica, 1953, vol. 1, no. 1, pp. 22–31. doi: 10.1016/0001-6160(53)90006-6.
  20. Tikhonov A.N., Arsenin V.Y. Solution of Ill-Posed Problems. Washington, Harper and Brace Publ., 1977. 258 p.
  21. Zeldovich V.I., Frolova N.Y., Kheifets A.E., Khomskaya I.V., Shorokhov E.V. Structural transformations in copper during high-speed deformation upon the convergence of a massive cylindrical shell under implosion. The Physics of Metals and Metallography, 2020, vol. 121, no. 5, pp. 446–451. doi: 10.1134/S0031918X20050154.
  22. Volkova E.G., Novikova O.S., Kostina A.E., Glukhov A.V., Volkov A.Yu. Structure and properties of Cu-based alloys diluted by Pd and Ag. IOP Conference Series: Materials Science and Engineering, 2020, vol. 1008, pp. 12026–12030. doi: 10.1088/1757-899X/1008/1/012026.
  23. Gong Y.I., Ren S.Y., Zeng S.D., Zhy X.K. Unusual hardening behavior in heavily cryo-rolled Cu-Al-Zn alloys during annealing treatment. Materials Science and Engineering: A, 2016, vol. 659, pp. 165–171. doi: 10.1016/j.msea.2016.02.060.
  24. Xin Y., Zhou X., Chen H., Nie J.-F., Zhang H., Zhang Y., Liu Q. Annealing hardening in detwinning deformation of Mg–3Al–1Zn alloy. Materials Science and Engineering: A, 2014, vol. 594, pp. 287–291. doi: 10.1016/j.msea.2013.11.080.
  25. Subramanian P.R., Laughlin D.E. Cu-Pd (Copper-Palladium). Journal of Phase Equilibria, 1991, vol. 12, no. 2, pp. 231–243. doi: 10.1007/BF02645723.
  26. Gong X., Wei B., Teng J., Wang Z., Li Yu. Regulating the oxidation resistance of Cu-5Ag alloy by heat treatment. Corrosion Science, 2021, vol. 190, article number 109686. doi: 10.1016/j.corsci.2021.109686.
  27. Straumal B.B., Kilmametov A.R., Baretzkyet B., Kogtenkova O.A., Straumal P.B., Litynska-Dobrzynska L., Chulist R., Korneva A., Zieva P. High pressure torsion of Cu-Ag and Cu-Sn alloys: Limits for solubility and dissolution. Acta Materialia, 2020, vol. 195, pp. 184–198. doi: 10.1016/j.actamat.2020.05.055.
  28. Syutkin N.N., Ivchenko V.A., Telegin A.B., Volkov A.Yu. Field-ion emission microscopy of early stages of ordering and precipitation of palladium copper silver alloy. Fizika metallov i metallovedenie, 1986, vol. 62, no. 5, pp. 965–969.
  29. Shashkov O.D., Syutkina V.I., Sukhanov V.D. Precipitating phase nucleation on periodical antiphase boundaries. Fizika metallov i metallovedenie, 1976, vol. 41, no. 6, pp. 1280–1287.

Supplementary files

Supplementary Files
Action
1. JATS XML
Download

Copyright (c)



This website uses cookies

You consent to our cookies if you continue to use our website.

About Cookies